產品圖片 | 名稱 | 型號 | 主要成份 | 熔點/PH值 | 粘度/比重 | 作業溫度 | 應用 | 儲存條件 |
美國AMTECH助焊膏 | RMA-223-uv/NC-559-asm | 美國AMTECH助焊膏(NC-559-ASM和RMA-223-UV)二.產品介紹:美國AMTECH研發了兩種使用于手機PCB,BGA及PGA等SMD之返修助焊膏,它使用于低離子性之活化劑系統,潤錫速度快,冒煙程度很低,殘留物固化后之表面絕緣阻抗值很高,因此,對手機等通訊產品之電性干擾非常小. | ||||||
AMTECH助焊膏 | RMA-223-UV | AMTECH助焊膏(NC-559和RMA-223)二.產品介紹:美國AMTECH研發了兩種使用于手機PCB,BGA及PGA等SMD之返修助焊膏,它使用于低離子性之活化劑系統,潤錫速度快,冒煙程度很低,殘留物固化后之表面絕緣阻抗值很高,因此,對手機等通訊產品之電性干擾非常小. | ||||||
無鹵助焊膏 | NC-669-LF | 無鹵助焊膏NC-669-LF is an RoHS-compliant lead-free, no-clean solder paste that delivers improved solderability with all Pb-Free metallization, including ENIG (Gold) | ||||||
水洗助焊膏 | LF-4300-TF | 水洗助焊膏LF-4300-TFThe LF-4300-TF is a medium viscosity water-washable, no-clean flux designed for tin-lead and lead-free alloys. LF-4300-TF is ideal for BGA | ||||||
AMTECH水洗無鉛錫膏 | LF-4300 | AMTECH水洗無鉛錫膏Introducing LF-4300 (lead-free) and 4300 (tin-lead), two revolutionary synthetic solder pastes that offer such unparalleled versatility and forgiveness, we still don’t believe it. | ||||||
AMTECH水洗錫膏 | NWS-4200 | AMTECH水洗錫膏All AMTECH solder pastes conform to ANSI/J-STD-006 and are available for immediate delivery in jars, cartridges, syringes and ProFlow Cassettes. | ||||||
AMTECH無鉛錫膏 | WS4900 | AMTECH無鉛錫膏Solder Paste formulae designed for today’s Surface Mount Technologies. All AMTECH solder pastes are available for immediate delivery in jars | ||||||
水洗有鉛錫膏 | 4300 | 水洗有鉛錫膏 一.產品特點 1.采用合成助焊膏 2.有著長時間的模板印刷壽命 3.寬的工藝窗口 4.對大多數電路板都擁有優良的潤濕性和優異的兼容性 5.有效的抑制BGA的空洞,且沒有錫珠和立碑 6. 助焊劑殘留物清晰,符合SIR根據IPC-TM-650.2.6.33的要求 | ||||||
AMTECH助焊筆 | AMTECH FLUX-RIGHTER | AMTECH助焊筆All AMTECH liquid fluxes are available in Flux-Righters, a unique tool for rework and touch-up soldering. |